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TREK MODEL 645 ±2 KV

TREK MODEL 645  ±2 KV
TREK MODEL 645  ±2 KV

Trek’s Model 645 software-driven Electrostatic Chuck Supply offers an array of features that provide significant benefits while accommodating a variety of demanding applications. Documented use shows that customers have seen increases in efficiency and throughput equal to three times that of other supplies. Additionally, the Model 645 virtually eliminates sticky wafer and wafer popping issues, thus ensuring better control over particle contamination. Given the versatility and performance of the Model 645, it can be used in multiple unique tools/processes, thus eliminating the need to specify a new supply for each unique tool/process in a facility.
Model: 645
Nhà sản xuất: Trek (USA)

FEATURES TREK MODEL 645  ±2 KV

  • Supports both Coulombic and Johnsen-Rahbek ESC technologies
  • User configurable for custom clamp and declamp sequences and wave shapes
  • Electrostatic chuck profiles can be uploaded to the unit and stored internally via a user-friendly software interface
  • Documented reduction of backside gas errors, increased throughput, and elimination of sticky/popping wafers
  • Lockable front panel control interface
  • Ability to control parameters such as over-current, wafer-present and wafer-clamped thresholds, clamp voltage, offset voltage and internal or external amplitude/offset control
  • Wafer detection includes no wafer, wafer present or wafer clamped status
  • Includes in-process-adjustable amplitude/offset and output-control versatility
  • Output can be controlled by back panel I/O, serial computer command or front panel controls
  • NIST-traceable Certificate of Calibration provided with each unit

SPECIFICATIONS MODEL 645 ±2 KV

  • Output Phasing: 

     Voltage A (Reference Phase):0 to ±2 kV

     Voltage B (Phase B = [-1] x Phase A):0 to ±2 kV

  • Output Voltage Range:0 to ±2 kV
  • Output Current Range:0 to ±6.5 mA DC with a peak capability of 10 mA

APPLICATIONS 

  • Electrostatic-driven handling of materials
  • Semiconductor wafer processing
  • Non-mechanical transfer of flat panels or other processing materials sensitive to mechanical clipping


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